matrixofdynamism
Advanced Member level 2
Like most people I am have encountered confusion with regards to ground planes on PCB.
(1) As far as I understand, the hole drilled for via is platted so I can connect to it at top or bottom. Is this assumption wrong?
(2) First I made top as power plane and bottom as ground plane. This works for through hole components quite well. I could easily connect to power and ground without needing trace. Is this approach wrong?
Main problem:
(3) I have SMD components, how do I connect them to ground plane? One idea is to make top as ground plane and use trace for VDD. I can still have bottom plane as VDD too for the through hole components. Is this the best approach?
(4) As far as I understand, the ground plane must be below the signal path, thus if I make the bottom ground plane, what is the best way to connect it to the ground plane to SMD components since I also need to use decoupling capacitors, probably several of them for different SMD components? Should these decoupling capacitors go onto the top or bottom of the board?
(1) As far as I understand, the hole drilled for via is platted so I can connect to it at top or bottom. Is this assumption wrong?
(2) First I made top as power plane and bottom as ground plane. This works for through hole components quite well. I could easily connect to power and ground without needing trace. Is this approach wrong?
Main problem:
(3) I have SMD components, how do I connect them to ground plane? One idea is to make top as ground plane and use trace for VDD. I can still have bottom plane as VDD too for the through hole components. Is this the best approach?
(4) As far as I understand, the ground plane must be below the signal path, thus if I make the bottom ground plane, what is the best way to connect it to the ground plane to SMD components since I also need to use decoupling capacitors, probably several of them for different SMD components? Should these decoupling capacitors go onto the top or bottom of the board?
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