ajitr99
Newbie level 3
Hi all,
I would like to know the key concerns while desiding different DRC rules for a new
process technology (CMOS) such as spacing between different layers, gate length,
gate oxide thicknes etc. Please help me out with your comments or with a good book/
documentation.
Thanks,
Ajith.
I would like to know the key concerns while desiding different DRC rules for a new
process technology (CMOS) such as spacing between different layers, gate length,
gate oxide thicknes etc. Please help me out with your comments or with a good book/
documentation.
Thanks,
Ajith.