leolib2004
Junior Member level 3
Hi,
I am almost ready to build a pcb but I am not really sure if I go to the standard specs, which uses lead-free HAL plating or to something custom using another plating. It will be done by Advanced Circuits, 4PCB, by the way.
How can one determine that?
The probably "more complicated" devices that I have on it are:
- a ATSAM S70 processor which uses LQFP-100
- a ATWINC1500-MR210, which is a wifi module and its pads and pitch are bigger compared the ATSAM.
- CS42L51, which uses a QFN32L package
-LT3028, DFN16 device
I have seen that the pitch is the main concern with plating and above 0.5 mm for the pitch, which is exactly my case, it should be fine. Is that right?
The assembly will be done using a reflow oven which I have read that it's fine for the lead free. There is also an environment issue around this but I just want this to work right now, that is my main concern.
Thanks in advance.
I am almost ready to build a pcb but I am not really sure if I go to the standard specs, which uses lead-free HAL plating or to something custom using another plating. It will be done by Advanced Circuits, 4PCB, by the way.
How can one determine that?
The probably "more complicated" devices that I have on it are:
- a ATSAM S70 processor which uses LQFP-100
- a ATWINC1500-MR210, which is a wifi module and its pads and pitch are bigger compared the ATSAM.
- CS42L51, which uses a QFN32L package
-LT3028, DFN16 device
I have seen that the pitch is the main concern with plating and above 0.5 mm for the pitch, which is exactly my case, it should be fine. Is that right?
The assembly will be done using a reflow oven which I have read that it's fine for the lead free. There is also an environment issue around this but I just want this to work right now, that is my main concern.
Thanks in advance.