rahulprem2013
Newbie level 4
Silicon wafer will break along {111} planes if enough stress is applied. Top surface of the wafer is a (100) plane.
suppose the pressure is applied at a point on the surface of the wafer and {111} plane cleavage occurs through the pressure point, then how many pieces at maximum wafer is going to break ?
Thanks
suppose the pressure is applied at a point on the surface of the wafer and {111} plane cleavage occurs through the pressure point, then how many pieces at maximum wafer is going to break ?
Thanks