jxw
Newbie level 3
How much, practically, does it matter to probe (at around 1-2GHz) a bare die chip with no floating wirebonds +pcb trace hanging unconnected, versus a probing the pads of a bare die chip that has been attached to the pcb and wirebonded( i.e. probes still contact pads but floating wirebonds +pcb trace are still there), but not through the path of the wirebond?
Going to stick ac probes directly to die pads and test up to around 2Ghz, the chip has been wirebonded to a pcb though, and wondering if I should swap out the chip with a completely unbonded bare chip and how much of a difference it will make. Thanks!
Going to stick ac probes directly to die pads and test up to around 2Ghz, the chip has been wirebonded to a pcb though, and wondering if I should swap out the chip with a completely unbonded bare chip and how much of a difference it will make. Thanks!
