manju_bhat
Junior Member level 3
Hi
I am planning to use a step down converter for one of my application. The IC is LT3693 , Linear make and the output requirement is 5V @ 2A . At full laod, IC generates a lot of heat. Since Ic is MSOP package, a proper heat sink has to be designed & PCB Pad area has to be given as heat sink. The power across IC is 2W. Could anyone suggest me how much PAD area need to be given exactly for such application. I do not have any handy calculation. Please help.
thanks.
I am planning to use a step down converter for one of my application. The IC is LT3693 , Linear make and the output requirement is 5V @ 2A . At full laod, IC generates a lot of heat. Since Ic is MSOP package, a proper heat sink has to be designed & PCB Pad area has to be given as heat sink. The power across IC is 2W. Could anyone suggest me how much PAD area need to be given exactly for such application. I do not have any handy calculation. Please help.
thanks.