anjana_das
Newbie level 5
![Newbie level 5](/styles/images/ranks/blevel2.gif)
Hello ,
Can anyone tell me how double bonded pads are handled during boundary SCAN test at the board level?
I have a design wherein there are 2 pads ( configured as outputs ) . Each pads have the corresponding BSCAN cells associated with them. But both the pads are bonded to a single ball in a BGA package.
Since both the PADs have separate BSCAN cells associated with them, chances are there that the BSCAN pattern which is used at the board level may force separate values onto the 2 pads leading to contention .
Can anyone let me know how such a scenerio should be handled during board test?? Is there anything that should have been done at the time of BSCAN cells insertion itself?
Thanks and Regards
Can anyone tell me how double bonded pads are handled during boundary SCAN test at the board level?
I have a design wherein there are 2 pads ( configured as outputs ) . Each pads have the corresponding BSCAN cells associated with them. But both the pads are bonded to a single ball in a BGA package.
Since both the PADs have separate BSCAN cells associated with them, chances are there that the BSCAN pattern which is used at the board level may force separate values onto the 2 pads leading to contention .
Can anyone let me know how such a scenerio should be handled during board test?? Is there anything that should have been done at the time of BSCAN cells insertion itself?
Thanks and Regards