Full contact and orthogonal contact in design for thermal desipation.

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praveenlb

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Hi,
I need a help, what is the impact if i use full contact in plane to ground pin or power pin instead of orthogonal connection ..?
Some people prefer orthogonal connection is better then full contact. i am thinking if full contact heat will flow all the area.. and dissipate fast..
am i wrong ?
 

Yes in full connect heat will be dissipated more.A pad directly connected to the copper pour would be difficult to solder,
since the heat provided by the soldering iron will quickly leak away from the pad and into the copper pour (due to high thermal conductivity of copper).
A thermal connection restricts the heat flow, making the pad easier to solder.
This is the reason why they would prefer to go with orthogonal or spoke connect.

Shabu
 
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