hervehman
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Hello everyone,
I was wondering if it was possible to put frames in the top layers of a multilayer pcb before lamination process. (The idea is to get cavities in a pcb to burry components.)
I have seen some "lasercavity" process from pcb suppliers. But why not framing layers before lamination ?
I was wondering if it was possible to put frames in the top layers of a multilayer pcb before lamination process. (The idea is to get cavities in a pcb to burry components.)
I have seen some "lasercavity" process from pcb suppliers. But why not framing layers before lamination ?