W_Heisenberg
Full Member level 4
What is the benefit for more metal layers?
And what are these metals? Iron? Or anything else?
And what are these metals? Iron? Or anything else?
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I didn't say this. I was talking about two metal interconnect layers. VDD and VSS are sharing it with signal interconnects. There are additional contact or via layers, but they are usually not counted as metal.Are you saying one layer for GND, and the other for VDD?
Routing (interconnecting standard cells ) is done over standard cells. As technology is shrinking standard cell size is decreasing and they are packed in very small area but interconnect scaling proportion to the standard cell size. So interconnect density is increasing. It is not possible to route VLSI chips using single layer. We need multiple layer of metals to route. Traditionally aluminium was used for interconnect material but aluminium has serious problem of electromigration. Now as copper is used as interconnect material as it don't have electromigration problem and resistance is also less compared to aluminium. So copper interconnects has less RC delay, hence faster.
Ok, so may I say more layers for interconnection then?
Thanks, man
---------- Post added at 17:51 ---------- Previous post was at 17:50 ----------
Nice anwser!
Thanks for your help.