Steve-Flextrapower
Newbie level 4
We are working on a flex circuit embedded in an insole. The components on the flex have been holding up well, but we have persistent problems with micro fractures developing on the traces over time causing signal failure. Being embedded in an insole (sandwiched between layers of foam), the flex is subjected to dynamic forces from the user's foot. Current manufacturing parameters of the flex are in the attached. The opens have been developing in the middle of the traces, not at vias or at the soldered components. The goal is to have the lifespan of the flex last at least 4 months, but it has been lasting only about 4-5 days. Any advice on how to increase the durability would be appreciated.