FreshmanNewbie
Advanced Member level 1
I'm using this device - ATSAMD21G17A
While I measured the connection between the exposed pad and the ground, they seem to be unconnected.
When I went and check on section 10, problem 20, on page 30 of this Checklist, I found the below:
Which effectively says us to connected the exposed pad to ground pins of the device and the PCB.
My question:
Can the exposed pad be left floating in any case, if I am taking care of thermal dissipation?
While I measured the connection between the exposed pad and the ground, they seem to be unconnected.
When I went and check on section 10, problem 20, on page 30 of this Checklist, I found the below:
Which effectively says us to connected the exposed pad to ground pins of the device and the PCB.
My question:
- Should the exposed pad of a device always be connected to the ground? If so, why? If the exposed pad should always be connected to the ground, then why do manufacturers, in this case, Microchip, do not connect the exposed pad and ground pins of the device together internally?
Can the exposed pad be left floating in any case, if I am taking care of thermal dissipation?