alan_lee
Newbie level 3
Hello,
Recently I received a PCB stackup design from my client that I feel the design is very odd, but I'm not sure whether the design can be fabricated or not? please refer in the following enquiries:
1) Client intended to use 3 layers(1 copper foil +1 core with 1oz of copper at top and bottom) to form a lamination prior to generate the buried Via. Can it be applied for lamination just for 3 layers?
2) for 200mil board thickness with 10mil finished hole size and 12mil of drill size. As it contains of High aspect ratio (16.7:1), will it be caused any problems for PTH process?
Thanks!
Recently I received a PCB stackup design from my client that I feel the design is very odd, but I'm not sure whether the design can be fabricated or not? please refer in the following enquiries:
1) Client intended to use 3 layers(1 copper foil +1 core with 1oz of copper at top and bottom) to form a lamination prior to generate the buried Via. Can it be applied for lamination just for 3 layers?
2) for 200mil board thickness with 10mil finished hole size and 12mil of drill size. As it contains of High aspect ratio (16.7:1), will it be caused any problems for PTH process?
Thanks!