Hi,
I read that:
To use 2 layer instead of 4 layers, it's better to place ground planes in both layers to minimize the EMI problems. Is it not correct?
Decoupling capacitors should be attached to each active components and a larger bulk decoupling capacitor for each voltage distributed on they board.
Shielded I/O cable connectors equipped with bypass capacitors or filter pins.
My doubts are:
I'm going to use 2 polygons planes for ground in my PCB because I have two different voltages that are coming from outside and I need to separate the two parts of my circuit. I think that I need a bulk decoupling capacitor for each voltage that comes on to the board.
For the transistors I was thinking to use in each one a decoupling capacitor, between gnd and power, but I'm not sure about the value, how can I choose the value of the decoupling capacitors? I read that I can use 0.001 uF, 0.01 uF or 0.047uF.
I am also use an external power supply without wire to earth and attach this earth to one of the earths inside my pcb through a capacitor, what do you think?
Am I right to my conclusions to design according to pass the EMC test?
I would like to know some books about EMC too, could you pass me the name of them?