abhijitrc
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Hi guys,
I just want to share one of the point related to the design of the microwave/Rf packages ,operating at ku-band, during the design of the rf package which consist of Rf section (three LNAs cascaded together), LO section ( Active doubler circuit, and a driver amplifier) and a down converter section( a schottky diode based mixer and an IF filter), all these sections are mounted in a common package, now my doubt related to interconnections are as:
a. In case of RF chain, where three LNAs are cascaded( all three Circuits have been fabricated on alumina substrate and mounted on individual kovar) and these amplifiers have been interconnected with ribbons, What will be the effect of inductance of the ribbons used in interconnections and how the behavior of the cascaded circuits changes!!!!. Is the overall gain may change??/ Noise figure may be effected and how??/ Shift in frequency due to impedance change ??And how to solve this problem practically!!!
b. In the LO section active doubler have been cascaded with a driver amplifier and they have been interconnected using ribbon, since the doubler is the nonlinear circuit and it has been interconnected with the driver amplifier( in between them a fiter is there to filter out un-wanted harmonics of the multiplier) what will be the effect of the inductance of the ribbon in their overall performance??
c.In the down converter section a schottky diode mixer followed by an IF filter also connected by ribbons, here how the inductance of the ribbon play its role!!!
LO section and the down converter have been mounted in the package, some differences have been observed from simulation, is this due to inductance of the ribbon???, Yet to mount the Rf section since it is a high gain chain!! what will be effect of inductance in that section!!
I just want to share one of the point related to the design of the microwave/Rf packages ,operating at ku-band, during the design of the rf package which consist of Rf section (three LNAs cascaded together), LO section ( Active doubler circuit, and a driver amplifier) and a down converter section( a schottky diode based mixer and an IF filter), all these sections are mounted in a common package, now my doubt related to interconnections are as:
a. In case of RF chain, where three LNAs are cascaded( all three Circuits have been fabricated on alumina substrate and mounted on individual kovar) and these amplifiers have been interconnected with ribbons, What will be the effect of inductance of the ribbons used in interconnections and how the behavior of the cascaded circuits changes!!!!. Is the overall gain may change??/ Noise figure may be effected and how??/ Shift in frequency due to impedance change ??And how to solve this problem practically!!!
b. In the LO section active doubler have been cascaded with a driver amplifier and they have been interconnected using ribbon, since the doubler is the nonlinear circuit and it has been interconnected with the driver amplifier( in between them a fiter is there to filter out un-wanted harmonics of the multiplier) what will be the effect of the inductance of the ribbon in their overall performance??
c.In the down converter section a schottky diode mixer followed by an IF filter also connected by ribbons, here how the inductance of the ribbon play its role!!!
LO section and the down converter have been mounted in the package, some differences have been observed from simulation, is this due to inductance of the ribbon???, Yet to mount the Rf section since it is a high gain chain!! what will be effect of inductance in that section!!
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