KnowYourSIP
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Hi,
Could you please let me know that IC Package Layout Design be it a SIP/MCM using any technology like WB or FC, can the design process be done independent of foundry who manufactures package provided I have foundry design rules available for that particular package or should it be designed in direct contact with foundry? or should the package design should also be done by foundry?
- what would be the best approach (self design or foundry design)?
- What types of issues we may be encounter if it's designed isolated and send the gerber to foundry for packaging
- Is their any cost advantage. If yes what whould be the difference in terms of percentage?
Any help.
Know.
Could you please let me know that IC Package Layout Design be it a SIP/MCM using any technology like WB or FC, can the design process be done independent of foundry who manufactures package provided I have foundry design rules available for that particular package or should it be designed in direct contact with foundry? or should the package design should also be done by foundry?
- what would be the best approach (self design or foundry design)?
- What types of issues we may be encounter if it's designed isolated and send the gerber to foundry for packaging
- Is their any cost advantage. If yes what whould be the difference in terms of percentage?
Any help.
Know.