Thanks yes i appreciate what you say...but our FSGM0565 has obseleted and we need to shoehorn something else in the same old assembly...the easient thing, is a TOP256GN, which due to its high profile body, means its case is nearer the metal enclosure, and so we can gap_pad its plastic case to that enclosure...i appreciate heat transfer wont be great out of the plastic body....but its better than nothing, and if it passes the thermal test, then we dont care anyway.
Thing is, will the gap_pad dry out?
I actually want to get rid of topswitch altogether, but everyone is topswitch mad, wherever you go...i'd rather just use a ceramic to220 fet and current mode controller, and screw it to the heatsink like they used to with the FSGM0565.