Zak28
Advanced Member level 2
Whats the necessary spacing required in which negligible amounts of EMI would be picked up by traces and components emanated from a flat heatsink raised to ~800VDC with a period of 8mS-12.5mS- 50% duty which would be right under a board with its traces?
Heatsink is isolated from all traces on board thus capacitve coupling is the mode in which EMI would be induced into components and traces. There are many different standoff studs available the proper distance would likely diminish any EMI into the board. The board is going to be mounted onto the flat heatsink.
Heatsink is isolated from all traces on board thus capacitve coupling is the mode in which EMI would be induced into components and traces. There are many different standoff studs available the proper distance would likely diminish any EMI into the board. The board is going to be mounted onto the flat heatsink.