Dec 8, 2005 #1 J joely2k Member level 1 Joined Dec 4, 2005 Messages 36 Helped 4 Reputation 8 Reaction score 3 Trophy points 1,288 Activity points 1,595 c4 pad Hi I am confused in some of this technology, Can any of you all tell me the differences between C4 Pads and BGA pads? Second question is , what is the differences between pads and bumps? are they the same? Thanks
c4 pad Hi I am confused in some of this technology, Can any of you all tell me the differences between C4 Pads and BGA pads? Second question is , what is the differences between pads and bumps? are they the same? Thanks
Apr 4, 2006 #2 P Pramod Junior Member level 2 Joined Aug 9, 2005 Messages 20 Helped 2 Reputation 4 Reaction score 0 Trophy points 1,281 Activity points 1,450 c4, bga Pad structure contains all metals ie from bottom to top metals.Bumps are designed using top metal. Genarally pad structures are used for PBGA type packages bump s are used for FCBGA packages
c4, bga Pad structure contains all metals ie from bottom to top metals.Bumps are designed using top metal. Genarally pad structures are used for PBGA type packages bump s are used for FCBGA packages