The strength and rated voltage are two different things.
If you are talking about only gaps , or creepage , the breakdown is typically 1-3 kV/mm for clean surface and much lower if contaminated with, dust, moisture, salts
You do not indicate the distance between "adjacent traces" or substrate material, or air moisture under which your device should operate.
General rule is: avoid putting voltages >100V between "adjacent traces", use quality substrate and apply conformal coating on the board to avoid water condensation. Use quality PCB connectors and make sure the HV circuit is fused.
I think mostly environmental conditions define test standards. I would use at least double voltage to test. Consider also possible occurrence of conductive dust which, combined with moisture, can and does damage mainly PCB connections
There's a number of standards specifying test voltages. I mostly refer to IEC1010.
For 300 V working voltage, basic insulation and overvoltage category I, the test voltage is 820 Vrms respectively 1150 V DC. Basic insulation and cat II (mains wiring) will be tested with 1350/1900V. For reinforced insulation and cat II (e.g. mains voltage against low voltage circuit), it's 2300/3250 V.
Transient voltage strength (e.g. tested with 1.2/50 µs pulses) is an alternative measurement method in safety standard. It's also specified in IEC1010. The test voltage is 1500 V for cat I basic insulation, generally about factor 1.8 of the AC Vrms for 1 min rating.
When the traces are on the outer layers of a PCB the dielectric is air and the spacing are for through air...
If you have high voltage you are better of putting the traces on inner layers then you can go down to around 0.25mm.