I just have a look at some typical stackups for standard PCBs. They have used 18 um (0,5 oz) on outer layers and 35 um (1 oz). Any reason for thinner copper layers on top and bottom. I guess a 10 mil trace can carry more current in inner thick layers compared to outer thin layers. Is that correct ?
Regarding the dielectric, we are working with standard PCB with typical heights 1.6 mm or 2.4 mm and they are not flex PCBs.
In the picture I shared in the first post. There are many FR4 dielectric in the list. What is the difference between high Tg, low Tg and mid Tg ? what is low CTEz and inorganic filters ? I would like to understand the consequences of these parameters while selecting the FR4.
Rogers is a name of the company or dielectric material ?
There is list of Rogers dielectric in the picture. Which one is better for high speed signals for example 10 Gbps Ethernet, USB 3.0 and PCI 3.0 in the design.
Steward mentioned Teflon, which dielectric in the picture have Teflon ?