From the cost perspective they both have the same price.
IC price is only one element of BOM cost, which is what
you (should) really care about.
An IC that requires more decoupling or high-end caps in
order to act right, or one that only approaches its advertised
performance with the most exotic magnetics, or needs a
6-layer PCB to get all the routes done, drives the BOM
cost out of proportion to its shelf price. You have alluded
to other concerns such as EMI which probably impact BOM
cost as well as maybe differentiating the two in dimensions
that aren't so immediately obvious.
If you live in (manufacture in) a locale with component
availability issues this may be even more of a problem, as
now it's not just about cost, but feasibility.
Might look and see if these two parts have vendor reference
designs and then drag a rake through the BOM and see how
the end solution stacks up.
Obtaining eval kits for both can let you see things that
Marketing doesn't want you to see.