varun79595
Newbie level 1
i am new to this PCb design field, I have few doubts as i started working on High speed designs,
1. Routing DDR3 signals on top layer instead of inner layer which one is preferred, in my design it is on top and bottom layer. what is the advantage?
2. Address and clock on separated layer, data on other layer what i can do if there is no space to route data signal separately.how i can proceed?
3. Spacing for each signal is 1x, 3x for Diff. pairs but how to follow the rules if i do not have enough room for it
1. Routing DDR3 signals on top layer instead of inner layer which one is preferred, in my design it is on top and bottom layer. what is the advantage?
2. Address and clock on separated layer, data on other layer what i can do if there is no space to route data signal separately.how i can proceed?
3. Spacing for each signal is 1x, 3x for Diff. pairs but how to follow the rules if i do not have enough room for it