dragonfury
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I just need some tips regarding what are the industry trends for complete custom chip layout floorplan?
- Do custom chip designs have some part of their chip empty to cater for thermal, stress or other kinds of design issues?
- If yes, then what is the criteria and what amount of chip area is kept vacant (i,e. without any active area)?
- Is process variations on a single die a main concern for creating such a chip?