Hi
@goatmxj666 ,
1. There is no need of a thicker metal for a subcircuit-to-pad routing, unless IR drop is a concern. Otherwise, a wide metal will give you more capacitive parasitics that might affect signal integrity.
2. As mentioned previously, buffering signals before bringing them out of chip is always a good idea. Moreover, placing a secondary protection might be a good solution for some sensitive signals.
3. It's better to connect CLK and analog signals through dedicated analog pads, they usually have low capacitance which makes them easy to drive and they do not corrupt the clock signal.
Hopefully, that helps.