To Radike,
Antenna check is layer by layer.
Which layer did you get this error? - if poly, then perhaps it might be the case, you are using too much poly for interconnect between the MOS gates.
Use Jumper rule first to avoid as much as you can.
Hi,
Thanks for the quick response. At the moment I am getting two types of errors.
First: cumulative metal area (M1 to Top Metal) to the related gate Poly2 area on thin gate devices
Second: Maximum ratio of Metal Top area to the related gate Poly2 area on thin gate devices.
I tried using jumpers. But I have 5 inductors connecting to my three transistors. Inductor uses thick metal top and big in size compared with Poly2 area on thin gate devices. So I think I need to use diodes.
I can pass the DRC even if I use the smallest diode. But can I trust DRC regarding this?
---------- Post added at 05:41 ---------- Previous post was at 04:39 ----------
The tinyest diode is enough, and only 1 (one) of them. Put it directly (anywhere) under the M1 connection of the resp. node, either n+ in p-substrate or p+ in n-well (n-well connected to VDD). Personally I think the latter one is safer, as it protects with just one diode forward drop against positive charges being injected during ion etch (in the very last seconds of the etch process, when the individual metal connections are separated from each other).
Hi,
Thanks for the quick reply. My circuit is similar to a Distributed amplifier topology. The errors are related to (Metal1 to MetalTop to the related gate poly2 on thin gate devices and MetalTop area to the related Poly2 area on thin gate devices). Is it possible to know what you meant by the resp. node?
Thanks alot!!!