Hi, I'm an Engineering working on a high current (100A) PCB and I am looking for a good way to check for full copper pours across multiple layers. I would prefer to work with the gerbers or an image. One thought I had was to stack images based on overlap to produce a 3D part whose height would be number of layers overlapping. Another thought was to have the color change based on layer overlap.
Any suggestions?
The goal is to be able to visually be able to spot choke points and constrictions.
Bill