Mabrok
Full Member level 4
Hi,
Regarding CGH40010F transistor provided by cree company to be used in PCB fabrication of RF power amplifier. Is it compulsory to use indium foil as a thermal interface? How if i use heat sink with thermal tape (included) like one in the attached link, where this thermal tape can be used as an alternative for indium foil? OR even placing the transistor directly to a heat sink? Please advice as this is my first time use this type of transistor and i am worry about device overheating and damages through the measurements. Thank you.
https://www.digikey.my/product-deta...ogy/TG-CJ-LI-12-12-10-PF/1168-2129-ND/5885788
Regarding CGH40010F transistor provided by cree company to be used in PCB fabrication of RF power amplifier. Is it compulsory to use indium foil as a thermal interface? How if i use heat sink with thermal tape (included) like one in the attached link, where this thermal tape can be used as an alternative for indium foil? OR even placing the transistor directly to a heat sink? Please advice as this is my first time use this type of transistor and i am worry about device overheating and damages through the measurements. Thank you.
https://www.digikey.my/product-deta...ogy/TG-CJ-LI-12-12-10-PF/1168-2129-ND/5885788