I'm not an engineer. I'm a retired electronics tech and have a question about problems with CEM boards.
Is the old CEM the same as CEM-1?
As far as I know, the cheaper form of CEM (CEM-1?) boards can't have plated vias because the coefficient of expansion of the CEM material would cause the vias to fail. Is that correct?
I see a lot of failures of connections in double-sided CEM boards with no plated vias where the wire lead of component is soldered top and bottom. Is this a known problem in the PCB design community? It's been known to techs for a long time but manufacturers still use it.