Via-in-pad (through-hole via, capped on bottom of the board) can cause voids in a BGA solder joint, which may impact reliability. Current data indicate that, for the standard 25 - 35 mm package with 0.75 mm balls, there is no reliability risk from voids. Accelerated aging tests have been performed and the failure rate was statistically equivalent to standard dog bone designs. It appears that void consistency is more important than void size with respect to solder joint reliability. Most experts agree that these void conditions, created due to entrapped air, are acceptable and have no impact on the reliability of the joint. There is no doubt that the conditions depend not only on the process, but the size of the land and the diameter of the hole. In addition, there is a difference as to whether the hole is a through-hole, blind via, or microvia.