Bluetooth 4.2 Die Size in 14nm Technology

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omara007

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Hi All ..

I'm trying to estimate the die size of a Bluetooth 4.2 chip (both digital baseband and RF front-end) on 14 nm technology. Does anyone know of any previous Bluetooth chip (4.0 or even earlier) die size under whatever technologies? .. preferably chips not integrated with any embedded processor like Cortex processors.

Thanks in advance.
 

well if you look at the Cypress 4xx7_BLE product, the CSP package is 3.51mm x 3.91mm, the technology is certainly 55nm or below.
but I don't know the proportion of analog/digital area.
 

Cypress 4xx7_BLE is a PSoC not a traditional ASIC .. this can't be 1:1 compared with non-programmable ASIC .. plus it's not only a BLE .. it also has a processor for the stack .. probably I should have said, I want to implement the PHY layer .. not the whole stack including the software ..
 

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