If you specify micro-vias or laser cut vias, then compute the via capacitance, inductance and SRF from any S/W tool and add the path length delay-lines to determine the distortion or loss added and compare TH via with blind via.
But also consider via max. current for a 20'C temp rise and adding more vias if necessary.
Generally in high-volume the cost is driven by total layer * copper area whereas in prototypes it is not.
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View attachment 185467