BGA Package Re-balling Guidance Required
Hi All,
I have 3 Components for BGA Reballing:
1. DDR2 SD RAM
Ball Size : 0.45 mm
Ball Pitch : 0.8 mm
Package Size : 8 mm X 12.5 mm
2. FF1136 BGA
Ball Size : 0.6 mm
Ball Pitch : 1.0 mm
Package Size : 35 mm X 35 mm
3. 208 PBGA
Ball Size : 0.6 mm
Ball Pitch : 1.0 mm
Package Size : 22.10 mm X 16.10 mm
There are 4 Files Attached. 3 are Data sheets for above mentioned components and 1 for a BGA Reball Kit available at my supplier.
The given stencils are not exactly as per our requirements, but there are some stencils with partial parameter matching.
We require:
FF1136 BGA
Ball Size : 0.6 mm
Ball Pitch : 1.0 mm
Package Size : 35 mm X 35 mm
The given stencil is 0.65 mm Ball Size, Pitch 1mm, 41x41 Matrix
DDR2 SD RAM
Ball Size : 0.45 mm
Ball Pitch : 0.8 mm
Package Size : 8 mm X 12.5 mm
The given stencil is 0.78mm Pitch with 0.45mm Ball size
Another is 0.81 Pitch with 0.5mm Ball Size, Matrix 40x40
Another is 0.78 Pitch with 0.5mm Ball Size, Matrix 35x35
Please let me know should I go for these stencils or I need exactly the identical stencils of Package Drawing.
Regards,
Maqbool