viperpaki007
Full Member level 5
Hi,
I used 196pin 0.4mm pitch BGA on my four layer PCB with the following layer stack
Now after the BGA assembly on PCBs the BGA pins show no connectivity. Manufactures say that the PCBs are bending while they heat the PCB for BGA soldering. Can anybody suggest what should be the recommended temperature of soldering this BGA package and are the materials used in PCB as prepreg and core are compatible with this heating temperature. I other words i need to know the temperature ratings of RO4350B and RO4403 PCB materials and also the recommended soldering temperature for 196pin BGA package. I would like to compare these values in order to make sure that my material selection for PCBs was right or not?
regards
I used 196pin 0.4mm pitch BGA on my four layer PCB with the following layer stack
Now after the BGA assembly on PCBs the BGA pins show no connectivity. Manufactures say that the PCBs are bending while they heat the PCB for BGA soldering. Can anybody suggest what should be the recommended temperature of soldering this BGA package and are the materials used in PCB as prepreg and core are compatible with this heating temperature. I other words i need to know the temperature ratings of RO4350B and RO4403 PCB materials and also the recommended soldering temperature for 196pin BGA package. I would like to compare these values in order to make sure that my material selection for PCBs was right or not?
regards