Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

BGA Connectivity issue

Status
Not open for further replies.
V

viperpaki007

Full Member level 5
Full Member level 5
Joined
Jul 2, 2008
Messages
274
Helped
11
Reputation
22
Reaction score
8
Trophy points
1,298
Location
Finland
Activity points
3,437
Hi,

I used 196pin 0.4mm pitch BGA on my four layer PCB with the following layer stack

Untitled.png

Now after the BGA assembly on PCBs the BGA pins show no connectivity. Manufactures say that the PCBs are bending while they heat the PCB for BGA soldering. Can anybody suggest what should be the recommended temperature of soldering this BGA package and are the materials used in PCB as prepreg and core are compatible with this heating temperature. I other words i need to know the temperature ratings of RO4350B and RO4403 PCB materials and also the recommended soldering temperature for 196pin BGA package. I would like to compare these values in order to make sure that my material selection for PCBs was right or not?

regards
 

Data sheet for BGA...
What speed is the board running at, does it really need fancy dielectric, if not a high temp FR4 would do.
Finally the assemblers should be able to recommend a profile.
 

I have experience of Soldering some BGA Packages....... some were Xilinx FPGA and some were Analog Devices' Compression Chips.... Every time we followed the Datasheet of the BGA Pakage and the result was OK....

Soldering Profile from Manufacturer is best to set your temperature zone ranges and timings.

Regards,
Maqbool

viperpaki007 said:
Hi,

I used 196pin 0.4mm pitch BGA on my four layer PCB with the following layer stack

View attachment 91108

Now after the BGA assembly on PCBs the BGA pins show no connectivity. Manufactures say that the PCBs are bending while they heat the PCB for BGA soldering. Can anybody suggest what should be the recommended temperature of soldering this BGA package and are the materials used in PCB as prepreg and core are compatible with this heating temperature. I other words i need to know the temperature ratings of RO4350B and RO4403 PCB materials and also the recommended soldering temperature for 196pin BGA package. I would like to compare these values in order to make sure that my material selection for PCBs was right or not?

regards
Click to expand...
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top