It was good that you used a short probe ground. I wonder how long the signal path and ground return is for the 0.1uF cap to supply.
Let's look at the ringing on the signal closely.
The overshoot is ~33% at a 1/2 division of 400ns/div= 200ns or 5MHz .
We know there must be a 2nd order LC effect.
At 5MHz , 0.1uF is 300m
The impedance at 3.3MHz for 0.1uF is approx 0.3 Ohm and the required L must be 10nH. This is a series resonance with the switch Rs, Cap and loop L which can be solved for the dampening factor or % overshoot in a 2nd order approximation. We could make it critically damped by making the switch resistance equal the resonant impedance at 5MHz by adding 0.3Ohms in series.
So what can cause 10nH? Trace impedance loop from Cap to supply and return, + vias if they exist or perhaps long leads on the cap with a low SRF. ( unlikely with SMT)
However to debounce the switch , like a pullup RC time constant must be longer than the bounce time (10k* 0.1uF= 1ms ) and if edge sensitive, either debounce in hardware (Schmitt Trigger) or software.
Increasing C would extend the RC rise time which is fast but also lower the LC resonant frequency and the impedance at resonance. Since the switch resistance might increase over time, you could increase C or add a series R or reduce the loop L to reduce overshoot. The protection clamp diodes have an ESR > 1 Ohm so your ringing source impedance is much lower than the clamp diodes.
So increase the source impedance with a series R between the switch and Cap would be the ideal solution to prevent latchup on the order of 10 Ohms for a 1us rise time. For metallic switches , quality contacts are gold plated and don't need a wetting current which can erode the plating. But non gold plated contacts can benefit from the surge current of 10% of the rated current.
So it depends also on the switch plating and the threshold for latchup. IF you exceed the device specs, it should be corrected.