sockets for 1wire and 6 sockets for external interfaces
DIP14 and DIP16 bases
Design:
Schematic diagram was made in EAGLE on base of ZL2-AVR scheme. As you can not place all the peripherals in such a system on one layer, the board was designed as double sided with emphasis on the bottom layer.
Implementation:
The board was made in thermal transfer method with sequentional etching. Remember that the holes of both layers must match perfectly. The description layer is self-adhesive with a laser print.
Assembly:
Guides were made with a thin wire. Make sure that all the guides were made, then stick a foil with a description and make holes for the elements using a needle. The rest of the assembly proceeds normally.