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Any reason for not doing backdrill under BGA

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buenos

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Is there any reason for not doing/allowing backdrill under BGA?
Maybe something that violates the soldering/assembly process?
I mean backdrill from the bottom, for 10G signals.
 

For that speed I would use HDI PCB design, you get more control of the 10G signals and it would probably be cheaper, less layers etc.
 

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