I thought about setting them up as blind vias which would generate a separate drill table as intended. However, if I set them up as blind vias, I'll need to add keepout regions to the layers above or below the via that will be back drilled to ensure that there are no clearance issues during the back drill process. Unfortunately you can't setup a DRC check on this to catch missing keepouts so you are forced to rely on manual validation. Depending on the number of back-drilled vias, this may be ok. Is this what you were suggesting?
If I leave them as full via stacks from top to bottom, then it's easy to setup the appropriate DRCs, but I'm back to the original problem of not having a separate drill table for the back-drilled vias. If I leave them as traditional blind vias, then the fab costs go up since I'm introducing multiple lamination stages. I'd like to keep it to a single lamination process and utilize a much cheaper back drilling option.
I guess I could setup a custom multi-layer footprint with integrated keepouts that I could use. I'll think about that.
If anyone else has any suggestions, I'd appreciate it. Thanks.