Re: About LTCC
LTCC is a good approach for a front end when cost and/or complexity are driving the design. It has decent thermal charateristics, although electrically, due to the roughness of the metalization, the losses can be a little higher than soft substrate.
Reasons to use LTCC:
- Extremely complex multilayer circuits (30+ Layers) including over 80,000 vias (blind, if necessary) per layer
- Touch labor is low compared to similar circuits in other substrates
- Very good precision
Reasons not to use LTCC:
- Vendor stability. The vendor's firing profiles vary to the point that you design to their process
- Shrinkage. While in local precision is excellent, a large scale shrinkage is rather unpredictable. Flatness is also an issue