about downbond question...

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downbond

Dear all:
I'm very confuse why we need seperate substrate and GND ?
Is that substrate cause more noise to effect GND or
GND cause more noise to effect substrate,please help me .

Thanks.
 

I am not quite sure what is your quesiton.
If it is downbond issue, it is usually just to avoid the two bonding wires (for example GND for p-sub process and VDD) too close to each other for packaging.

regards,
jordan76
 

I think GND cause more noise to effect substrate, especially to digital GND.
 

Thanks for yours help.

Maybe I should describe my question again.

My colleague told me, Substrate will cause more noise than GND ,
So we must seperate these two Ground,but I'm not sure is it true or not ?

Thanks.
:?: :?: :?:
 

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