Bonding wire pitch

[rafauy]

Hello,

Im designing a padring for a chip that will probably be bonded with a manual bonding machine (a new machine but entry-level). The pad area is 60umx60um aprox. set by the technology requirements but Im not very familiar with the needed pad pitch and how many filler cells should I place in between them. I was thinking about a pad pitch of 200 um to be on the safe side. According to your experience, does this sound reasonable? Is less (e.g, 150um) too demanding on the technician skills (assuming the machine is capable)?
Thanks

 

[dick_freebird]

Probably OK with spacing down to 75% of pad opening, pitch as low as 100u, as long as no violations of wire-over-other-pad etc. 60u pad should be barely OK for 1mil gold wire but this comes down to operator skill.