10MSOP soldering: Hot plate temperature & Air gun temperature?

[cupoftea]

Hi,
We need to solder some 10MSOP TPS57040's for prototype boards.

Do you know what is max allowable temperature of hot plate and hot air gun for this? (it has an under-chip thermal pad)

TPS57040

https://www.ti.com/lit/ds/symlink/tps57040-q1.pdf?ts=1643317409647&ref_url=https%253A%252F%252Fwww.google.com%252F

(i just searched the web but nowhere told of the max allowable temeprature)

 

[FvM]

The datasheet specifies 260°C peak solder temperature, just the PB-free standard.

 

[betwixt]

You should contact TI for the baking and soldering temperature profiles. If they have been outside their moisture protective bags/tape for more than a day or so you should bake them to prevent moisture expansion fracturing the package or lead bond and the soldering temperature may have to be raised in stages following the manufacturers recommended profile.

Brian.

 

[KlausST]

Hi,

I tried an internet search "TI soldering HVSSOP".

Klaus

 

[cupoftea]

You should contact TI for the baking and soldering temperature profiles. If they have been outside their moisture protective bags/tape for more than a day or so you should bake them to prevent moisture expansion fracturing the package or lead bond and the soldering temperature may have to be raised in stages following the manufacturers recommended profile.

Brian.

Thanks, does this apply to some IC's more than others?

I soldered 10 LT3680 10MSOPs a year ago with no problem...mind you, i did not use a hot plate.

Also, if they are out of the outer silver package (the one containing the dessicant), but still in their "tape", then does that still mean they are "out of package"?

 

[FvM]

Did you notice that the tape has venting holes? And it won't be gas tight even without it.

Reflow soldering in the prototype and rework lab involves a risk of overheating components, but even with heat gun, you can achieve a good yield. For thin packages with exposed pad, hot plate or reflow oven or preferred. Or a combination of IR preheating from the downside and heat gun, as necessary for rework and double side populated boards.