acm_45
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Hi,
I'm working for the first time with DDR3 ram components, I have to mount directly on the pcb 4 DDR3 modules controlled by a xilinx FPGA.
I'm a little bit confused by DDR3 layout rules, I understand that I've to follow the fly-by topology described in JEDEC specifications between the modules but my doubt is about the trace length matching from the fpga to the modules, in some specifications I read that all the data bus of all module must have the same length, in other documents I read that every module must have data bus as short as possible without a trace match between modules. Depending by these rules the pcb layout will result not so difficult or a nightmare.
I know that in the firmware I could delay the control signals but I want to design the best pcb layout.
Thank you in advance
I'm working for the first time with DDR3 ram components, I have to mount directly on the pcb 4 DDR3 modules controlled by a xilinx FPGA.
I'm a little bit confused by DDR3 layout rules, I understand that I've to follow the fly-by topology described in JEDEC specifications between the modules but my doubt is about the trace length matching from the fpga to the modules, in some specifications I read that all the data bus of all module must have the same length, in other documents I read that every module must have data bus as short as possible without a trace match between modules. Depending by these rules the pcb layout will result not so difficult or a nightmare.
I know that in the firmware I could delay the control signals but I want to design the best pcb layout.
Thank you in advance