Can anyone offer advice regarding PCB layout of the signal ground and chassis ground under and in the vicinity of an integrated RJ45 with magnetics (dual 10/100/100 ETHERNET)
This is a 6 layer board.
In the past (without integrated magnetics) I would pour chassis ground under the RJ45 up to the PHY side of the separate magnetics, and signal ground under the remainder of the board up to the MAC side of the magnetics, with a void in between the signal and chassis planes under the discrete transformer. I'm not sure what best practices are when using an integrated magnetics module.