Is there any Design rule & guidelines for a 0.2mm pitch BGA PCB design, Is it advice-able to use blind vias for BGA SMD pads as having not enough space b/w two adjacent pads?
any help would be appreciated.
"0.2mm pitch BGA"? Which component are you referring to?
Generally speaking, you'll use all available advanced PCB techniques, e.g. micro vias, plugged vias (vias on pad), blind and buried vias to implement a HDI design.
Thanks, I guessed that some guys are already thinking about 0.2 mm BGA ball pitch. As said in the other link, 0.5 mm is a ususal lower limit these days (and already demanding for HDI PCB technology).
Thus I was primarly doubting that the OP is asking about 0.2 mm BGA pitch. If he's actually dealing with 0.2 mm pitch he would ask differently, or not ask at Edaboard at all.