T
treez
Guest
Hello,
Please help us to pass conducted emissions of EMC testing, particularly with reference to common mode noise created by the switching node of our 1W Buck converter
We have a 1W Buck converter (bias supply) on our offline 150W LED driver PCB (which uses linear current regulators).
It firstly failed EMC due to having the Buck’s switching node copper layed out all over the bottom PCB layer, where it was next to the earthed heatsink. (common mode emissions).
We now have removed the switching node copper from the bottom layer. However, do you believe that we should shield the switching node copper (which is now only on the top layer) from the earthed heatsink by putting some “quiet node” copper underneath the switching node of the Buck, in order to shield the switching node from the earthed heatsink on which the PCB sits?
(eg we could put the “quiet node copper” on middle and bottom layers of the 4 layer board. The switching node copper is now only on the top layer. The PCB sits on a thin thermal pad which is on the earthed heatsink)
Please help us to pass conducted emissions of EMC testing, particularly with reference to common mode noise created by the switching node of our 1W Buck converter
We have a 1W Buck converter (bias supply) on our offline 150W LED driver PCB (which uses linear current regulators).
It firstly failed EMC due to having the Buck’s switching node copper layed out all over the bottom PCB layer, where it was next to the earthed heatsink. (common mode emissions).
We now have removed the switching node copper from the bottom layer. However, do you believe that we should shield the switching node copper (which is now only on the top layer) from the earthed heatsink by putting some “quiet node” copper underneath the switching node of the Buck, in order to shield the switching node from the earthed heatsink on which the PCB sits?
(eg we could put the “quiet node copper” on middle and bottom layers of the 4 layer board. The switching node copper is now only on the top layer. The PCB sits on a thin thermal pad which is on the earthed heatsink)