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crystal planes commonly used in silicon wafer fabrication

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allennlowaton

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Good day guys...
Please help me with this...
I'm having a trouble regarding what type of crystal planes (100, 110, 111) is/are commonly used in silicon wafer fabrication..
And please add also a supporting reason why is it being chosen/preferred.

Thank you very much.
 

Re: crystal planes commonly used in silicon wafer fabricatio

allennlowaton said:
I'm having a trouble regarding what type of crystal planes (100, 110, 111) is/are commonly used in silicon wafer fabrication..
And please add also a supporting reason why is it being chosen/preferred.
Click to expand...
Standard is 100, cf. .
 
Re: crystal planes commonly used in silicon wafer fabricatio

In addition to channeling and etching issues already mentioned
the 100 direction also provides the best interface conditions. If
I remember right that was the biggest problem during the
development of n-Fet devices. Having bad surface conditions
leads to a lot of 'opens' at the interface between substrate surface
and the gate -> loads of electrons get trapped -> high vt. Maybe this
is used nowadays for some special devices ...

Best Regards

Andi
 
I believe we used 111 for some dielectric isolated bipolar
processes, because it gave the best tub-etch behavior.
 
I remember <111> being used for the DI bipolar process, it creates the v-shaped grooves. 100 is all I ever see now
 
Re: crystal planes commonly used in silicon wafer fabricatio

Thank you very much for the information being shared guys.
That had been a great help.
 

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