winglj
Full Member level 4
Hi, everyone. I have a question about the multi-layer PCB for RF passives.
Right now I ran out of the space to put my microstrip power dividers and hybrids on a two layer PCB design. And I am thinking whether I can put the power divider into the other layer which is sandwiched by two ground plane as a stripline structure, and use PTH to connect it to the hybrid on the layer on top for microstrip structure. So the structure stack-up is something like this one:
--------- <- hybrid layer
000000 <- dielectric substrate 1
--------- <- GND 1
0000000 <- dielectric substrate 2
--------- <- power divider layer
0000000 <- dielectric substrate 3
--------- <- GND 2
I am wondering whether this idea can work? If yes, what kind of issues should I be aware? And any reference to the multi-layer RF PCB design will be welcomed. Thanks.
Right now I ran out of the space to put my microstrip power dividers and hybrids on a two layer PCB design. And I am thinking whether I can put the power divider into the other layer which is sandwiched by two ground plane as a stripline structure, and use PTH to connect it to the hybrid on the layer on top for microstrip structure. So the structure stack-up is something like this one:
--------- <- hybrid layer
000000 <- dielectric substrate 1
--------- <- GND 1
0000000 <- dielectric substrate 2
--------- <- power divider layer
0000000 <- dielectric substrate 3
--------- <- GND 2
I am wondering whether this idea can work? If yes, what kind of issues should I be aware? And any reference to the multi-layer RF PCB design will be welcomed. Thanks.