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polyamide and passivation layer

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ashish_chauhan

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Can someone tell me the difference between polyamide and passivation layer and its use ...
 

passivation is used to create opening in the die so that the chip can be BONDED out.

Polymide is used for bump on die ( ie no bond wire).

The passivation layer goes down first, then polymide and then a layer called UBM which creates the opening for the ball.

You might be able to get information from AMKOR, I have the design specs etc for it, due to confidentiality I cant post it here!

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